Layered Assembly
Layered Assembly is a nascent, voxel based additive manufacturing process in which premanufactured voxels are used as raw material to carry out the digital fabrication of multi-material parts[1]. In previous literature, Layered Assembly has been referred to as digital materials[2][3][4], 3D voxel printing[5], and even rapid assembly. By using premanufactured voxels as feedstock, Layered Assembly seeks to improve on two main bottlenecks of present day additive manufacturing: multi-material compatibility, and relatively low material deposition rates. As a nascent additive manufacturing process, Layered Assembly is not a Standard Additive manufacturing process as established in ASTM F2792 [6].
Similar to other voxel-based manufacturing approaches, Layered Assembly has equally profound implications for design as for manufacturing. This is in part because present day design practices are poorly equipped to deal with the modularity and discretization associated with voxel-based parts.
As a layer-by-layer additive process, Layered Assembly can be carried out by a variety of mechanisms, although arrangements where voxels are gripped by solid-state grippers, tend to accommodate smaller voxel sizes, and higher part resolution. Solid-state gripping in layered assembly has been achieved by both electro-osmotic[7], electrostatic, and mechanical[8] means of voxel gripping.
References
- ↑ "Parallel electrostatic grippers for layered assembly". Additive Manufacturing. 27: 451–460. 2019-05-01. doi:10.1016/j.addma.2019.03.032. ISSN 2214-8604.
- ↑ Lipson, Hod. Fabricated. Search this book on
- ↑ Popescu, G. "Digital Materials for Digital Fabrication". Retrieved 2021-08-02. Unknown parameter
|url-status=ignored (help) - ↑ MacCurdy, Robert; McNicoll, Anthony; Lipson, Hod (2014-09-01). "Bitblox: Printable digital materials for electromechanical machines". The International Journal of Robotics Research. 33 (10): 1342–1360. doi:10.1177/0278364914532149. ISSN 0278-3649.
- ↑ Hiller, Jonathan; Lipson, Hod (2009-01-01). "Design and analysis of digital materials for physical 3D voxel printing". Rapid Prototyping Journal. 15 (2): 137–149. doi:10.1108/13552540910943441. ISSN 1355-2546.
- ↑ www.astm.org. doi:10.1520/f2792-12a https://www.astm.org/cgi-bin/resolver.cgi?F2792-12A. Retrieved 2021-08-03. Missing or empty
|title=(help) - ↑ Perich, Cheryl; MacCurdy, Robert; Macner, Ashley; Mici, Joni; Steen, Paul; Lipson, Hod (2021-07-12). "Electro-Osmotic Gripper Characterization for Layered Assembly". 3D Printing and Additive Manufacturing. doi:10.1089/3dp.2020.0224. ISSN 2329-7662.
- ↑ Hiller, Jonathan; Mici, Joni; Lipson, Hod (2020-10-28). "Layered assemblers for scalable parallel integration". Journal of The Royal Society Interface. 17 (171): 20200543. doi:10.1098/rsif.2020.0543. PMC 7653397 Check
|pmc=value (help). PMID 33081644 Check|pmid=value (help).
Layered Assembly
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