Richard A. Gottscho
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Richard Alan Gottscho (May 19, 1952), also known as Rick,[1] is an American scientist,[2][3] physical chemist, spectroscopist, inventor,[4] educator,[5][6] and business executive.[7][8] He was the CTO of Lam Research.[9]
Career[edit]
Gottscho employed photodetachment optogalvanic spectroscopy (POGS) to measure negative ions and collaborated to advance the use of actinometry in characterizing plasma electronic properties.[10] His inventions and publications during this period pertain to real-time, in situ characterization of surfaces exposed to reactive plasmas by using spectroscopic techniques such as attenuated total reflection Fourier transform infrared (ATR-FTIR) spectroscopy[11] and galvanic detection of photoemission.
In 1993, Gottscho became Head of the Display Research Department and R&D Technical Manager for High-Resolution Technologies until 1995.[12][1]
In May 2002, Gottscho was named Vice President of Conductor Etch and Resist Strip Products.[8][9] In January 2013, Gottscho was promoted to Executive Vice President and Corporate Officer in Lam Research's Global Products Group.
Between 2012 and 2017, Lam teams to conduct atomic layer etching demonstrations using controlled beams of ions and neutrals and apply the learning at scale on 300 mm wafers. They uncovered two predictive trends: first, ALE synergy is correlated with surface binding energy, where synergy is a measure of the ALE efficacy (100% being perfect); and second, there is an inverse relationship between exposure time and ion energy for the ALE process window, i.e., where synergy is highest.[13][14][15][16][17]
From May 2017 to March 1, 2023, Gottscho was the Chief Technology Officer (CTO) at Lam Research.[12][18][19][20][1]
As CTO, he launched a program to transform lithography from wet to dry processing for extreme ultraviolet (EUV) patterning.[21][22] Gottscho also created a strategic alliance with Entegris and Gelest (Mitsubishi Chemical) to ensure reliable supply of dry-resist precursor materials to semiconductor manufacturers.[23] At Lam Research, Gottscho initiated the company's Industry 4.0 transformation.[24][25]
In 2022, Gottscho contributed to Innovating at Speed and at Scale: A Next Generation Infrastructure for Accelerating Semiconductor Technologies,[26] Accelerating Semiconductor Research, and Accelerating America.[27]
Also in 2022, in Geneva, Switzerland, Gottscho gave a talk entitled "What's inside? How did it get there? What's next?" at the FIRST Global Final Competition, where he announced a Lam Research Corporation donation to FIRST Global for $10M over three years.[19]
References[edit]
- ↑ 1.0 1.1 1.2 Shih, Willy. "Semiconductor Manufacturing: Making Impossibly Small Features". Forbes. Retrieved 2023-09-22.
- ↑ "The Chip Insider® 2020 All Stars And Hall Of Fame" (PDF).
- ↑ "Three from MIT elected to the National Academy of Engineering". MIT News | Massachusetts Institute of Technology. 2016-02-09. Retrieved 2023-09-22.
- ↑ Kanarik, Keren (2020-03-19). "Big Problems In A Little Data World". Semiconductor Engineering. Retrieved 2023-09-22.
- ↑ "Semiempirical profile simulation of aluminum etching in a Cl 2/BCl 3 plasma". scholar.google.com. Retrieved 2023-09-22.
- ↑ "Aspect ratio independent etching: Fact or fantasy?". scholar.google.com. Retrieved 2023-09-22.
- ↑ "Richard A. Gottscho's research while affiliated with Lam Research Corporation and other places".
- ↑ 8.0 8.1 "FPD China - speaker - Richard Gottscho". www.fpdchina.org. Retrieved 2023-09-22.
- ↑ 9.0 9.1 "Variable temperature processes for tunable electrostatic chuck". scholar.google.com. Retrieved 2023-09-22.
- ↑ "Optical emission actinometry and spectral line shapes in rf glow discharges". scholar.google.com. Retrieved 2023-09-22.
- ↑ "Real-time monitoring of surface chemistry during plasma processing". scholar.google.com. Retrieved 2023-09-22.
- ↑ 12.0 12.1 Dr. Richard Gottscho | Using Plasmas to Make Computer Chips, retrieved 2023-09-22
- ↑ "Overview of atomic layer etching in the semiconductor industry". scholar.google.com. Retrieved 2023-09-22.
- ↑ "Atomic layer etching: rethinking the art of etch". scholar.google.com. Retrieved 2023-09-22.
- ↑ "Predicting synergy in atomic layer etching". scholar.google.com. Retrieved 2023-09-22.
- ↑ "Moving atomic layer etch from lab to tab". scholar.google.com. Retrieved 2023-09-22.
- ↑ "Universal scaling relationship for atomic layer etching". scholar.google.com. Retrieved 2023-09-22.
- ↑ "Yahoo | Mail, Weather, Search, Politics, News, Finance, Sports & Videos". www.yahoo.com. Retrieved 2023-09-22.
- ↑ 19.0 19.1 "Lam Research Pledges $10 Million to FIRST Global - News". Silicon Semiconductor. Retrieved 2023-09-22.
- ↑ "Smart systems for semiconductor manufacturing". MIT News | Massachusetts Institute of Technology. 2019-11-25. Retrieved 2023-09-22.
- ↑ LaPedus, Mark (2020-03-19). "Improving EUV Process Efficiency". Semiconductor Engineering. Retrieved 2023-09-22.
- ↑ Kanarik, Keren J.; Osowiecki, Wojciech T.; Lu, Yu (Joe); Talukder, Dipongkar; Roschewsky, Niklas; Park, Sae Na; Kamon, Mattan; Fried, David M.; Gottscho, Richard A. (April 2023). "Human–machine collaboration for improving semiconductor process development". Nature. 616 (7958): 707–711. doi:10.1038/s41586-023-05773-7. ISSN 1476-4687.
- ↑ "Lam Research, Entegris, Gelest Team Up to Advance EUV Dry Resist Technology Ecosystem". Lam Research Newsroom. Retrieved 2023-09-22.
- ↑ "Lam Research Perspective | HARTING Technology Group". www.harting.com. Retrieved 2023-09-22.
- ↑ "Moving atomic layer etch from lab to fab | Semiconductor Digest". Retrieved 2023-09-22.
- ↑ "Innovating at Speed and at Scale: A Next Generation Infrastructure for Accelerating Semiconductor Technologies".
- ↑ "Accelerating Semiconductor Research, Accelerating America" (PDF).
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