United Semiconductor Japan
United Semiconductor Japan Co., Ltd. (USJC) is a pure-play wafer foundry company with a 300 mm wafer fab in Kuwana, Mie Prefecture, Japan.
USJC is a member of United Microelectronics Corporation (UMC), the world's second largest foundry company, which is headquartered in Taiwan and provides semiconductor manufacturing services as a foundry located in Japan.
 USJC Mie fabriek in Kuwana, -3 februari 2023.jpg | |
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Native name | ユナイテッド・セミコンダクター・ジャパン株式会社 |
|---|---|
| Public (KK) | |
| ISIN | 🆔 |
| Industry | Semiconductor Foundry |
| Founded 📆 | December 1, 2014 |
| Founder 👔 | |
| Headquarters 🏙️ | , |
Area served 🗺️ | Worldwide |
Key people |
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| Members | |
Number of employees | 1057 (as of the Apr 1, 2022) |
| Parent | UMC |
| 🌐 Website | https://www.usjpc.com/en/ |
| 📇 Address | |
| 📞 telephone | |
Overview
The former company, Mie Fujitsu Semiconductor Ltd. (MIFS) was a joint venture of Fujitsu Semiconductor Ltd. and UMC. The state-of-the-art memories and other products had been developed and mass-produced at Mie Plant since it began operation in 1984.
In October 2019, MIFS was renamed USJC and turned into a wholly owned subsidiary of UMC. USJC’s headquarters has been newly established in Yokohama, Kanagawa Prefecture and the manufacturing base has remained in Kuwana, Mie Prefecture.
"Semiconductors made in Kuwana" is the tagline of USJC.
Features of Mie Plant
Start of operation B1 building : 2005 B2 building : 2007
Total floor area B1 building : 38,000㎡ B2 building : 80,000㎡
Clean room area B1 building : 17,000㎡ B2 building : 30,000㎡
Process technology 40nm, 55nm, 65nm, 90nm
Production capacity approx. 35,000 wafers/month
Certification ISO9001, IATF16949, ISO14001, ISO27001, ISO22301
Characteristics
・One of the largest logic manufacturing capacities in Japan
・Foundry featuring specialty technologies such as automotive flash
microcontrollers, LCD drivers, RF devices, Power IC
・Experienced engineers and advanced process porting technology
・Automotive quality, BCM support
A Long and Productive History
1984 Fujitsu Mie Plant was established
1992 The world's first CMOS LSI for supercomputers was developed
2003 Mass production of 90nm Cu multilayer interconnect process was started
2004 New building with the world's first hybrid seismic isolation structure for 300mm wafer was constructed
at Fujitsu Mie Plant
2006 Second building for 300mm wafer was constructed at Fujitsu Mie Plant
2008 LSI Division spun off from Fujitsu and was established as Fujitsu Microelectronics Limited
2010 Fujitsu Microelectronics Limited was renamed Fujitsu Semiconductor Limited
Production of semiconductor chips for the supercomputer "K” was started
2013 Mass production of semiconductor chips with DDC transistors was started
2014 Mie Fujitsu Semiconductor Limited (MIFS) was established
2015 The world's first 40nm process manufacturing line fully employing Swirling Induction Type HVAC system (SWIT ®)[1]
was constructed.
2016 Quality Management System was certified (ISO 9001:2015)
Quality Management System for the automotive industry was certified (IATF16949:2016)
2019 Environmental Management System was certified (ISO 14001:2015)
MIFS was renamed United Semiconductor Japan Co., Ltd.(USJC)
2020 Information Security Management System was certified (ISO/ICE 27001:2013)
2021 Business Continuity Management System was certified (ISO 22301:2019)[2]
2022 DENSO and USJC announced collaboration on the production of automotive power semiconductors[3]
Occupational Health and Safety Management System was certified (ISO 45001:2018)
footnote
- ↑ "Swirling Induction Type HVAC System SWIT®". Takasago Thermal Engineering. Retrieved 2022-12-28.
- ↑ "Business Continuity Management System". USJC. Retrieved 2022-12-28.
- ↑ "DENSO and USJC Collaborate on Automotive Power Semiconductors". USJC. Retrieved 2023-02-08.
External link
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