BaySand, Inc.

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BaySand, Inc.
File:BaySand Logo.jpg
Private
ISIN🆔
IndustryIntegrated Circuits
Founded 📆2009; 13 years ago (2009)
Founder 👔Jonathan C Park
Salah Werfelli
Sam Appleton
Headquarters 🏙️San Jose, California, U.S.
Area served 🗺️
Worldwide
Key people
Salah Werfelli

President CEO
Jonathan C Park

Vice President CTO
Products 📟 ASIC, Multi-project wafer service
Members
Number of employees
🌐 WebsiteBaySand.com
📇 Address
📞 telephone

BaySand, Inc. is a privately held American technology company headquartered in Morgan Hill, California, that designs, licenses, develops, and sells semiconductor solutions around the world. The company is primarily known for their patented Metal Configurable Standard Cell (MCSC) technology platform and Field Configurable Digital Signal Processing (fcDSP) architecture. Based on the technologies, they provides wide range of semiconductor products and solutions, particularly in application configurable ASICs.

BaySand was founded by Jonathan C Park and Salah Werfelli on September, 2009, in the Silicon Valley to develop and sell application configurable ASIC's with an emphasis on a short TTM and low-cost NRE. BaySand specializes in FPGA conversion to ASIC.

History[edit]

Early Days[edit]

On Sep 2009, Jonathan Park, Salah Werfelli & Dr. Sam Appleton founded BaySand Inc. in California, USA. Same year, BaySand setup their research & development center in Penang, Malaysia.

Growth[edit]

On June 21, 2016 BaySand completed the acquisition of FalconX Accelerator, a provider of Low Power Digital Signal Processing (LP-DSP) IP with a wide range of configurations[1]. The addition of FalconX provides BaySand's technology with low power parallel processing with significant reduction and increased performance over the classic multi-core CPUs, DSP, or GPU parallel processing technologies.

Patents[edit]

Products[edit]

SoC & ASSP - mcCAP[edit]

The Metal Configurable Custom Application Platform (mcCAP) is a technology that facilitates the reuse of design, architecture, and components of a SOC or ASSP by customizing only a few metal layers. According to BaySand, this platform allows for enhancements or new features of SoCs in a short amount of time (2~4 months) without having to redesign a new chip.

ASIC - mcASIC[edit]

The Metal Configurable ASIC platform is similar to the mcCAP platform, but allows for greater flexibility in device features – in terms of functionality, logic gates, I/Os, memories, etc.

BaySand's mcASIC allows the use of custom or proprietary IP.

FPGA to ASIC Conversion - mcFPGA[edit]

mcFPGA is BaySand's solution for FPGA to ASIC conversion. BaySand stated that mcFPGA provides pin-compatible & function-compatible drop-in replacement for several popular FPGAs, including Altera's Stratix and Xilinx's Spartan. A full list of compatible FPGAs can be found within their device mapper tool. In their mcFPGA product page, BaySand also stated that the first engineering sample will be available within 8-10 weeks.

ASIC Multi Product Wafer (MPW) Shuttle - ASIC UltraShuttle[edit]

BaySand launched their ASIC Multi-Product Wafer (MPW) Shuttle program, ASIC UltraShuttle,[2] on August 2016. BaySand stated that, as compared to traditional MPW shuttles, BaySand allows customers to hand off and sign off their design in RTL. BaySand also stated that under this program, they will deliver 100 fully tested and packaged chips, with ATPG, BIST and DFT included, in 8 weeks.

Licensing[edit]

BaySand licensed its Metal Programmable Technology to Toshiba since year 2012.[3] Toshiba's FFSA is astructured array custom vehicle that incorporates technology from BaySand[4].

Partnership[edit]

On Aug 2016, EnSilica & BaySand announced their partnership to work on ASIC Multi-Product Wafer (MPW) on 65nm process, ASIC UltraShuttle-65. With this partnership, BaySand's customers are accessible to EnSilica's IPs, e.g. eSi-RISC processor, eSi-Connect processor peripherals, eSi-Crypto encryption and eSi-Comms communication IP[5].[6]

Japan[edit]

On Oct 2012, BaySand & Marubun Corporation announced their partnership, Marubun will be the distributor to bring MCSC product to Japan[7].

China[edit]

On Apr 2016, BaySand & Alignment Company Ltd announced their partnership to bring BaySand's products and solution to China

Related News[edit]

References[edit]

  1. "BaySand Buys FalconX Accelerator For DSP IP | silicontap.com". www.silicontap.com. Retrieved 2016-08-15.
  2. "BaySand to Initiate a Unique Low Cost Multi Project Wafer (MPW) Program That Redefines the Silicon Shuttle Concept".
  3. "Toshiba licenses ASIC tech from BaySand, will ship chips in April". www.businesswire.com. Retrieved 2016-08-15.
  4. "Toshiba's IP subsystem for 10GbE on SoC; and on Toshiba Structured Array". 2016-03-25. Retrieved 2016-08-15.
  5. "EnSilica and BaySand cooperate on configurable MPW IP solutions". 2016-08-18. Retrieved 2016-08-19.
  6. "EnSilica and BaySand team on 65nm MPW runs". 2016-08-17. Retrieved 2016-08-18.
  7. "BaySand, Inc. and MARUBUN Corporation Form a Strategic Partnership ..." 2012-10-18. Retrieved 2016-08-15.

External links[edit]



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